Chipset OEM B2B
Chipset OEM B2B is DeepGrid Semi's bare SoC2 die, supplied in tray or reel with reference design documentation and toolchain access for customers to place on their own board. Priced at ₹18,000, it delivers the highest gross margin in the portfolio at 94% and is projected by management to generate ₹54 Cr in FY2032 revenue on 30,000 units without DeepGrid needing installation capacity, certification, or warranty logistics.
- Listed price
- ₹18,000
- FY2032 revenue
- ₹54 Cr
- Share of plan
- 4.8%
- Gross margin
- 94%
- First revenue
- FY2028
- Volume plan
- 30,000 @ FY32
From input to outcome
Proposed product architecture. The scene illustrates its application, not a shipped kit.
The customer's own sensors feed their own board
The SoC2 die does the perception compute inside their design
Their software decides what to do with the result
Their product ships, with our silicon inside it
Drag to rotate. Conceptual layout, not a mask.
On the die
Chipset OEM B2B
Sold as the bare SoC2 die: all six domains.
The case in brief
- Chipset OEM B2B delivers the highest gross margin in the portfolio at 94%, projected by management to generate ₹54.0 Cr on 30,000 units in FY2032 without requiring installation, certification, or warranty overhead.
- Supplied as a bare SoC2 die designed for TSMC 28 nm, with a 39.3 TOPS design target, the product serves Tier-1 suppliers and vehicle manufacturers seeking domestic silicon alternatives to costly imported modules.
- Commercial execution depends entirely on qualified silicon emerging from tapeout and closing direct, high-commitment design-in cycles with automotive engineering teams.
What it is used for
Tier-1 Braking and Perception Subsystem Integration
- Buyer
- Tier-1 suppliers and OEMs with in-house hardware teams
- The job
- Tier-1 suppliers must incorporate perception compute into custom boards inside an accountable safety case, wanting Indian-designed silicon and domestic supply rather than an imported module. DeepGrid does not own brake actuation, calibration, homologation, or warranty, leaving system-level responsibility with the integrator.
- What DeepGrid supplies
- DeepGrid supplies the tested and binned SoC2 die in tray or reel with reference designs and toolchain access, allowing the customer's hardware to execute on-chip perception while their proprietary software determines actuation.
Commercial Vehicle OEM Hardware Integration
- Buyer
- Tier-1 suppliers and OEMs with in-house hardware teams
- The job
- Vehicle manufacturers with internal engineering teams require domestic supply rather than an imported part, navigating direct design-in engagements where OEM design-in runs 18 to 30 months. They require bare silicon to place directly onto proprietary vehicle boards rather than buying an integrated module.
- What DeepGrid supplies
- DeepGrid provides the bare die with a datasheet and integration documentation, enabling customer sensors to feed their own board while SoC2 performs perception compute inside their design.
The story
Bare SoC2 silicon supplied directly for customer board integration at portfolio-leading gross margins.
DeepGrid supplies the bare SoC2 die in tray or reel with reference designs and toolchain access for customers to mount onto their own hardware. The product eliminates enclosures, cabling, and installation services, providing tested silicon alongside integration documentation so the buyer handles the rest. Selling at ₹18,000, this line delivers the most profitable revenue in the business plan at a 94% gross margin.
- ₹18,000Unit price
- 94%Gross margin
- SemiconductorsSegment
- OutdoorOperating domain
- FY2028First revenue
- SoC2 die, tested and binnedDelivered component
The SoC2 die executes perception compute within the customer's proprietary board architecture.
External sensors feed the customer's board directly, where the SoC2 die processes incoming perception streams inside their proprietary hardware design. The customer's software determines vehicle actuation from that compute, allowing their finished product to ship with DeepGrid silicon inside. Designed for TSMC 28 nm and not yet fabricated, the roughly 57 mm² die targets 39.3 TOPS of compute (a design target) and 102.4 GB/s memory bandwidth, leaving physical board integration entirely with the buyer.
- TSMC 28 nm, roughly 57 mm²Process and die area
- 39.3 TOPS design targetPerception compute
- 32,768 MACsCompute architecture
- 102.4 GB/s dual-channel LPDDR5Memory bandwidth
- Working, qualified siliconCritical dependency
Tier-1 suppliers and OEMs choose domestic silicon to satisfy localization priorities and internal engineering needs.
The buyer base comprises Tier-1 automotive suppliers and OEMs with in-house hardware teams capable of board-level integration. Procurement policies favoring Indian-designed silicon and domestic supply drive customers away from imported modules, supported by the ADAS mandate. Engaging this market requires direct design-in relationships, targeting a management-projected 0.25% capture of an India ADAS chip pool estimated at $2.29B in 2024.
- Tier-1 suppliers and OEMsTarget buyer
- Direct design-in engagementsSales channel
- Domestic supply over importsPurchase trigger
- 0.25% at FY2032Management projected capture
- $2.29B at 20.6% CAGR2024 ADAS chip pool
Chipset OEM adds high-margin revenue to the portfolio without consuming field operations capacity.
Management projects Chipset OEM B2B to generate ₹54.0 Cr on 30,000 units by FY2032, accounting for 4.8% of group revenue at a 94% gross margin. Because customers manage board assembly, vehicle certification, and field service, revenue expands without demanding internal installation or warranty infrastructure. Every unit in this line remains strictly downstream of successful tapeout qualification.
- ₹54.0 CrFY2032 projected revenue
- 30,000 unitsFY2032 projected volume
- 94%Gross margin
- 4.8%Share of group revenue
- Working, qualified siliconCritical dependency
- ₹0 CrFY270 units
- ₹0.05 CrFY2830 units
- ₹3.15 CrFY291,750 units
- ₹10.8 CrFY306,000 units
- ₹27 CrFY3115,000 units
- ₹54 CrFY3230,000 units
See it running
The platform behind this product, running in simulation.
What has to go right
Product viability depends entirely on working, qualified silicon downstream of ASIC tapeout completion and qualification. Because bare die sales provide no enclosure or integration layer, every unit in this line is downstream of the tapeout landing. DeepGrid must secure direct design-in engagements with Tier-1 suppliers and OEMs with in-house hardware teams through long cycles and high commitment, where OEM design-in runs 18 to 30 months. DeepGrid must also provide sufficient reference designs and toolchain support so integrators execute their own software without requiring broad OEM customisation or safety-case ownership from DeepGrid.
Key dependency ASIC tapeout completion and qualification.
Further reading and viewing
Watch
The Chipset OEM B2B in the narrated walkthroughOne silicon. The full story. From 10:53Film: Eleven sensors, one outputThe 8.6 ms frame budget on the compute box · 0:54Read
The SoC2 die under every productTechnology: the siliconInvestment memorandum: Use casesWhat Deepgrid sells, and what it does notCommercial use case UC-06Government and PSU perception kitBusiness Plan v2, workbookSheet: MarketAsk DeepGrid about the Chipset OEM B2BAny question, answered from the same documentsRelated products
Prices, volumes, revenues and margins are management projections. The text is written from the linked documents, and every figure in it appears in the source it came from.