Deepgrid Semi
DG32 · LOCKSTEP RISC-V MOTOR-CONTROL SILICONPRE-SILICON · ENGINEERING EVIDENCE
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Technical documents, decks and films.

Start with the portfolio for product scope, the evidence register for maturity, or the detailed documents for integration. Every source has a different role in an evaluation.

9 product specifications

Architecture and electrical specifications

Simulation results, timing budgets, clock partitions and pin assignments all come from these documents. Download a PDF, read its specification, or check a figure against its section in .

DOC #1 · EDGE AI COMPUTATIONEdge AI & Diagnostics

Thirty Use Cases, No Accelerator

50 MHz RV32IM edge AI compute envelope, 19 lightweight models, fixed-point DSP pipeline & CWRU audit

Formal proof that high-accuracy industrial condition monitoring and predictive diagnostics do not require heavy transformer acceleration or multi-watt NPU arrays. By exploiting the architectural inversion that comparisons and table lookups cost almost nothing on an integer CPU, tree ensembles achieve parity with deep learning (95.6% vs 97–100% on CWRU bearing benchmarks) while requiring zero multiplications and running 50–500× faster.

Compute Engine50 MHz RV32IM (Zero NPU)
Scalar Ceiling12.5 MMAC/s (int8)
RAM Ceiling16.5 KB SRAM budget
Standard ComplianceISO 13373 / 20816 / 20958
Key architectural proofs
  • 12.5 MMAC/s integer budget leaves 82% CPU headroom at 10 kHz FOC current loop rate
  • Single-bin Goertzel DFT replaces multi-megabyte FFT buffers for broken rotor bar detection
  • Documents non-monotonic Kurtosis trap: kurtosis drops as spall rounds over, requiring RMS cross-checking
  • Uncovers critical 100% synthetic accuracy leakage in academic CWRU bearing benchmark datasets
DOC #7 · SKU BLUEPRINTProduct Portfolio

SKU Blueprint, October 2026 (11 SKUs + D100)

The source of record for every SKU on this site. One handout per SKU: what it replaces, market, share needed, unit economics, buyers, policy driver, process choice and the FPGA-to-chip boundary

The current product portfolio. Each SKU is a standalone handout answering the same nine questions: what the part is, what it replaces, how big the market is, what share is needed and whether that is realistic, what each unit earns, who buys it, the policy driver, why this process node, and where the FPGA prototype ends and the chip begins. Adds SKU-10 DG32-Max Secure MCU and SKU-11 SOH-Aware BMS Controller to the earlier nine. Volumes, prices and shares are the company’s own estimates.

Portfolio11 SKUs plus the Track B D100 drone SoC
ProcessSkyWater 130 nm and SCL 180 nm; SKU-7 on IHP SG13G2
FormatNine questions per SKU, answered in the same order
ShuttleNine prototypes on the ChipFoundry December 2026 shuttle
Key architectural proofs
  • New in this edition: SKU-10 DG32-Max Secure MCU and SKU-11 SOH-Aware BMS Controller
  • Each SKU states what it replaces, who buys it, the policy driver and why its process node was chosen
  • Status per SKU: what is RTL-ready, simulated or FPGA-validated, and which parts take the December 2026 shuttle
  • The D100 drone SoC is Track B, funded by a separate round and taking nothing from the eleven chips’ budget
DOC #3 · HARDWARE DSHOT RX RTLHigh-Speed Motor Telemetry

dgrid_dshot_rx RTL Specification

Hardware DShot receive engine, bidirectional GCR 4b→5b eRPM telemetry reply & pad-ring reuse

Complete RTL engineering specification for dgrid_dshot_rx: offloads ESC motor signal decoding and bidirectional eRPM telemetry reply entirely into deterministic hardware logic. Features glitch-free pad-ring direction reuse without external analog multiplexers, early-abort frame suppression, and floorplan trade-off recovering 4,800 µm² die area.

Data RatesDShot150 / 300 / 600 / 1200
Telemetry EngineHardware GCR 4b→5b eRPM reply
Memory BusSlot 0xC APB memory-mapped
Floorplan Area28 KB vs 32 KB SRAM layout lever
Key architectural proofs
  • Zero-CPU overhead motor command capture and validation up to DShot1200 rates
  • Autonomous GCR 4b→5b eRPM packet assembly and transmission without software intervention
  • Bidirectional GPIO pad-ring reuse with deterministic turnaround timing
  • 28 KB vs 32 KB SRAM floorplan trade-off analysis for sky130 multi-project shuttle packaging
DOC #4 · DUAL-DOMAIN SOC & ATTENTIONCondition Monitoring & Attention

DG32-2DOM Architecture & Block Definition

Dual 50/114 MHz clocks, 4-phase CDC bridges, INT8 attention engine & AVIP diagnostics

System architecture of DG32-2DOM: adds an INT8 multi-head self-attention engine on an independent 114 MHz clock domain alongside the frozen 50 MHz lockstep control core. Robust 4-phase CDC bridges isolate domains so condition monitoring cannot stall the motor control loop. Utilizes AVIP stator current signature analysis to detect bearing faults with zero additional sensor BOM.

Clock Partition50 MHz Control · 114 MHz Attention
CDC Mechanism4-Phase Asynchronous Handshake
Attention CoreINT8 Multi-Head (40-bit Accumulator)
Sensorless MCSAAVIP Stator Current Bearing Analysis
Key architectural proofs
  • Rigorous dual-clock domain isolation: control loop worst-case execution time guaranteed untouched
  • 40-bit accumulator headroom prevents INT8 softmax overflow and numerical saturation
  • AVIP stator current diagnostics isolate inner/outer race bearing faults without accelerometers
  • 18 on-die SRAM macros occupying 86% of sky130 active die area with positive timing slack
DOC #5 · DEFENCE & ECONOMIC STRATEGYGeopolitics & Strategic Moats

Mature-Node Silicon for India’s Defence (Whitepaper v3)

$9B mature-node import funnel, 198-day loop, 10x NRE dismantling & DAP-2020 Make-II statutory moats

The foundational 71-page master whitepaper establishing India’s mature-node semiconductor doctrine. Sizes India’s roughly $9B mature-node import funnel, and shows how open-source EDA and shared MPW shuttles bring NRE to ₹0.6–1.2 Cr per chip against $2–5M for a conventional flow, creates statutory moats through 'Boxes, Not Chips' integration under DAP-2020, and models Chinese supply disruption resilience. September 2026 edition, superseded in part by the October SKU Blueprint (chip count, clock, orders, funding). Its orders figure includes a contract this site withholds as misdescribed; do not cite it.

Import Funnel$9B Mature-Node Defence Market
Tapeout Cadence198-Day Shuttle Loop
NRE Economics₹0.6–1.2 Cr (10x NRE reduction)
Legal FrameworkDAP-2020 Make-II · PIL-1..5 · SRIJAN
Key architectural proofs
  • $9B mature-node import funnel prioritized across 10 critical defence semiconductor SKUs
  • 198-day tapeout loop from RTL freeze to packaged silicon delivery using OpenLane EDA
  • Statutory moats under DAP-2020 Make-II and Ministry of Defence positive indigenisation lists
  • Rigorous Charlie Munger inversion audits and strict stop-rules S1–S4
DOC #6 · DATASHEETS & PINOUTPackaging, Clocks & Electrical Rules

Preliminary Engineering Datasheets & Package Pinout

64-pin QFN 9×9mm pin mapping, 100% LITE/2DOM compatibility, supply sequencing & ROM boot

Preliminary engineering datasheet for DG32-LITE and DG32-2DOM in QFN-64. The two chips share one pinout: DG32-2DOM is a pin-compatible drop-in for DG32-LITE boards. Mandates strict power supply sequencing (3.3V I/O must lead 1.8V core by ≥1 ms to protect ESD rail diodes), defines 64 KB mask boot ROM operations, and maps all 44 signal pins.

Package SpecQFN-64 (9×9 mm, 0.5 mm pitch)
Signal Pins44 Signal Pins across 11 groups
Supply Rails1.8V Core · 3.3V I/O (Sequenced)
CompatibilityIdentical pinout (LITE & 2DOM)
Key architectural proofs
  • Identical 64-pin footprint allows one PCB layout to take either DG32-LITE or DG32-2DOM
  • Strict power supply sequencing protects internal ESD rail clamps from latch-up breakdown
  • 44 functional signal pins organized into 11 functional clusters with dedicated return paths
  • 64 KB autonomous boot ROM with flash header validation and fallback UART monitor
PLATFORM · D100 DRONE SOCTactical Drone Flight Systems

D100 Tactical Drone Platform Architecture

Flight control, visual navigation and optional AI on one 28 nm chip, with an isolated hardware failsafe island

Heterogeneous multi-core SoC for tactical unmanned aerial systems. Partitions flight compute into high-performance vision/navigation (Quad RV64) and hard real-time flight control (Quad RV32), backed by a physically isolated hardware failsafe island that takes over motor control upon main OS hang or communication loss.

Process28 nm; failsafe island buildable at 130 nm
Failsafe DomainIsolated hardware failsafe island
Flight controlLockstep RISC-V pair on a DO-254 path
FundingTrack B: separate round after mature-node revenue
Key architectural proofs
  • Hardware failsafe island executes emergency return-to-launch (RTL) independent of Linux host
  • 8 hardware-timed DShot motor channels with microsecond-level synchronization
  • Direct hardware cryptographic authentication for secure datalinks
  • Sub-watt low-power standby modes for extended loiter missions
PLATFORM · SDV ZONAL E/EAutomotive Zonal Controllers

DG SDV Software-Defined Vehicle Zonal Architecture

Distributed zonal controllers eliminating vehicle wire harness mass and latency

Automotive zonal E/E reference architecture replacing complex point-to-point body harnesses with 4 distributed zonal gateways. SKU-9, the zonal gateway, carries the zonal I/O: Gigabit TSN Ethernet, CAN-XL and 16 smart e-fuses in place of electromechanical relays, with software updates centralised.

Power switching16 × smart e-fuses (48 V / 12 V)
Vehicle bus4 × CAN-XL, up to 20 Mbps
Zone Clusters4 × Zonal Controllers
Safety targetISO 26262 ASIL-D (target, not certified)
Key architectural proofs
  • Gigabit TSN Ethernet and CAN-XL in place of electromechanical relays and point-to-point wiring
  • Deterministic CAN-XL and 10BASE-T1S automotive Ethernet backbones
  • Local hardware motor control and current sensing for high-reliability body actuators
  • Hardware fault confinement designed to the ISO 26262 ASIL-D target
STRATEGY · SOVEREIGN SILICONManufacturing & Fab Strategy

Three-Factory Sovereign Silicon Architecture

Strategic manufacturing arbitrage across SkyWater, SCL Mohali, and Dholera 28nm fabs

Geopolitical and fab-arbitrage blueprint for Indian semiconductor sovereignty. Aligns design tooling so RTL can port seamlessly between US open-access fabs (SkyWater), Indian strategic fabs (SCL Mohali 180nm), and emerging commercial mega-fabs (Tata Dholera 28nm), guaranteeing supply continuity across international supply crunches. September 2026 edition, superseded in part by the October SKU Blueprint (chip count, clock, orders, funding). Its orders figure includes a contract this site withholds as misdescribed; do not cite it.

Foundry NetworkSkyWater · SCL Mohali · Dholera 28nm
Node Distribution180nm BCD · 130nm CMOS · 28nm Planar
Supply ResilienceSanction-proof multi-foundry PDKs
Economic Model₹10 Cr Capital Efficiency
Key architectural proofs
  • Multi-foundry PDK portability preventing vendor lock-in to single fabs
  • Zero-NRE open-source toolchain (OpenLane/Magic/KLayout) validated on test silicon
  • Strategic arbitrage between high-voltage BCD (actuators) and dense CMOS (controllers)
  • Proof of concept for India’s ₹10 Cr sovereign chip initiative

Product architectures

Electrical specifications and first-silicon design

Lockstep safety on an entry-level motor chip

Download the deck (.pptx)
DG32-LITE Architecture deck, slide 1: Lockstep safety on an entry-level motor chip
SLIDE 01 / 16Lockstep safety on an entry-level motor chip

DG32-LITE: system architecture and functional interfaces

Component-flow diagram behind the deck, with the numbered data path. Open the source in draw.io to edit it.

DG32-LITE system architecture diagram

Numbered markers

  1. Marker ①: The PWM period centre fires the ADC sample, where current ripple is lowest.
  2. Marker ②: Phase current goes to the CORDIC, which runs the Clarke and Park transforms with the rotor angle.
  3. Marker ③: The transformed currents go to the CPU, which runs the d and q PI regulators in plain C.
  4. Marker ④: The PI output sets the PWM duty in shadow registers that load at the next period boundary.
  5. Marker ⑤: Gate signals leave for the external gate driver.
  6. Marker F: FAULT_N from the fault latch turns the bridge off in hardware, without firmware.

Block responsibilities

Safety core

MAIN runs the application. CHECKER runs the same instructions two cycles later on identical inputs, the comparator checks every committed store, and the fault latch holds the first cause and drives FAULT_N.

Why A silent datapath fault produces a wrong PWM edge, and a wrong edge can destroy a bridge.

Guide: Safety core
Memory and boot

The 64 KB mask ROM validates the flash image, copies it into 32 KB of dual-port SRAM and jumps to it. One SRAM port serves data, the other instruction fetch.

Why The die has no management core and no debugger halt, so the boot path must start the chip on its own.

Guide: Memory and boot
Supervision

The windowed watchdog faults a kick that arrives too early or too late. The interrupt controller delivers 16 sources identically to both cores.

Why Identical delivery is what keeps CHECKER in step when firmware branches on an interrupt or a peripheral read.

Guide: Safety core
On-chip bus

Two masters, the CPU first and the DMA second, with single-outstanding, deterministic latency. An unmapped or disabled address completes with a bus error.

Why On a chip with no debugger, a hung bus would be a brick.

Guide: Bus, system and test
Motor drive

Centre-aligned complementary PWM on six gate pins with dead-time, and a hardware brake that forces all six outputs off within two clock cycles. Four DShot channels share the PWM pads.

Why Gate timing and the safe state are too important to leave to a firmware loop.

Guide: Motor drive
Sensing and math

Encoder and Hall decode with edge timestamps, an 8-bit differential SAR ADC fired by the PWM, and a CORDIC for sin, cos and atan2 at a fixed cost per operation.

Why The CPU core is fetch-bound at about 8 cycles per instruction, so the expensive parts of the loop are hardware.

Guide: Sensing and math
Connectivity and test

Two UARTs, an SPI master, an I²C master and GPIO with atomic set and clear. JTAG and internal scan chains serve production test.

Guide: Connectivity
Off-chip

QSPI NOR flash holds the application image. The gate driver and three-phase bridge, the motor sensors and the host sit outside the package.

Guide: Power-on boot

Primary sources

7 integration and validation references

Background reading explains the general technique each block uses. None of it describes this part or implies its certification.

Engineering references

  • DG32-LITE block architecture (design premises, block internals, loop budget, post-route fmax)
  • DG32-LITE preliminary datasheet (pinout, supplies, boot, power estimate)
  • DG32-LITE investor block diagram (applications, STM32G0 positioning, roadmap)
  • DG32-LITE tape-in block diagram (checker timing, mirrored bus responses)
  • DG32-2DOM preliminary datasheet (identical pinout)

Investor-level content from Deepgrid Semi’s September 2026 design documents: no register maps, memory map or board-design rules. Pre-silicon: figures are design values, process nominals or analytic estimates, labelled on each slide.

Illustrative DeepGrid DG32 controller board with an external power stage and motor connector
DG32 control and hardware safety. New DeepGrid product concept · concept illustration, not a product photograph or deployment evidence. DeepGrid silicon remains pre-silicon.